Welcome to Tecci

More than 30 years of experience are our guarantee as manufacturers
of high-quality printed circuit boards for professional electronics.

Welcome to Tecci

Effort, professionalism and know-how are the mainstays of the company's workforce.
The continuous improvement in our processes has always been a constant in our organisation.

Welcome to Tecci

We work based on the customer's design. Our technical staff collaborates and
advises to guarantee the quality of the product from the very start.

Tecci Webwww.tecci.com

Multilayer Printed Circuit Boards

Electronic technology continuously tends to focus its development on reducing the size and increasing the capacity of the printed circuit boards. This constant evolution of microelectronics has had a great impact on the development of printed circuit boards.

In response to this greater demand for interconnection by surface unit, in 2008 TECCI strengthened its productive capacity incorporating state-of-the-art lines and machinery for the manufacture of prototypes and small series of multilayer circuits up to 8 layers, with a capacity to manufacture 1000 m2 per month at our facilities.

Download technical specifications

Technical Capacities

 

Standard

Special

Comments

Materials

Type

FR4 Tg 135ºC

 

Other materials to order

 

 

FR4 Tg 135ºC AntiCAf

 

 

 

FR4 Tg 150ºC AntiCAf

 

 

 

FR4 Tg 170ºC AntiCAf

 

 

 

FR4 Tg 150ºCAntiCAf-Halogen free CTI 2

 

 

 

 

 

Internal Layers

0,25mm

 

Other thicknesses to order

 

0,36mm

 

 

 

0,50mm

 

 

 

0,71mm

 

 

 

 

 

 

Prepregs

1080---0.65mm

 

Other thicknesses to order

 

2116---0.115mm

 

 

 

7628---0.190mm

 

 

Stack-up

 

 

 

Total thickness

0,8-2,4

 

 

Initial copper thickness

18-35-70

 

Other thicknesses to order

Maximum number of layers

8

 

 

Silkscreen Printing Inks

Photosensitive Mask

Green, Black, Blue, Red

White LED

Other colours to order

Silkscreen Components

White, Black, Yellow

 

Other colours to order

Graphite

 

Yes

 

Peelable Ink

 

Yes

 

Surface Finishes

HASL Sn/Cu

Yes

 

 

HASL Sn/Pb

Yes

 

 

Chemical Tin

Yes

 

 

OSP

Subcontracted

 

 

ENIG

Subcontracted

 

 

Hard Gold

Subcontracted

 

 

Mix of surface finishes

Chemical Tin + Nickel-Gold Connector

No

 

 

HASL + Nickel-Gold Connector

Yes

 

 

ENIG + Nickel-Gold Connector

Yes

 

 

Minimum drill hole diameter

0,30 mm

 

 

Minimum diameter of metallised drill hole

0,20 mm

 

 

Scoring

Angle

30º

 

 

Milling

Standard milling cutter diameter

2 mm

1-1,6-3,2

 

Capacities internal layers

Minimum Width of the conductor

 

 

 

Base copper 17µm

127µm

 

 

Base copper 35µm

150µm

127µm

 

Base copper 70µm

200µm

175µm

 

Minimum conductor space: (Airgap)

Base copper 17µm

127µm

 

 

Base copper 35µm

150µm

127µm

 

Base copper 70µm

200µm

175µm

 

Minimum insulations

Minimum insulation between final drill hole and antipad

Final drill hole + 0,65

 

 

Aislamiento mínimo entre pads y antipads

Tamaño de Pad + 0,60

Tamaño de pad + 0,45

 

Minimum insulation between final pads and antipad

Size of Pad + 0,45

Size of Pad + 0,35

With Teardrops

General

Distance between conductor and plate edge

0,5 mm

With milling 0,2 MM

 

Capacities External Layers

Minimum Width of the conductor

 

 

 

Base copper external layers 17µm

150 µm

127µm

 

Base copper external layers 35µm

175 µm

150µm

 

Base copper external layers 70µm

225 µm

200µm

 

Minimum space between conductors: (Airgap)

Base copper external layers 17µm

150 µm

127µm

 

Base copper external layers 35µm

175 µm

150µm

 

Base copper external layers 70µm

225 µm

200µm

 

Distances Pad-Metallised drill hole

Minimum pad for metallised drill hole

final hole size +0,35

final hole size + 0,25

With Teardrops

General

Distance between conductor and plate edge

0,5 mm

WITH ROUTING 0,2 MM

 

Soldermask

Minimum width of Mask outline

100µm

80µm

For green ink

Crown of Mask

100µm

75µm

 

Thickness of mask on metal

5/30µm

 

 

Mask register

125µm

75µm

 

Electric test

Continuity Resistance

30 ohm

10 ohm

 

Voltage of the Test

150-200 V

250 V

 

Insulation Resistance

25 Mohm

100 Mohm

 

Maximum size Test template

230x300

 

 

Maximum testable size FlyingProbe

457x610

 

 

Minimum distance between test points

0,18 mm

 

 

Minimum distance between test pads

0,08 mm

 

 

Documentation

Documentation files format

GERBERS, DPF

 

 

Drilling file format

GERBERS, DPF,EXCELLON, SIEB MEYER

 

 

Drilling file format

GERBERS, DPF,EXCELLON, SIEB MEYER

 

 

Electrical files format

IPC 356

 

 

Comparison netlist format

IPC 356

 

 

Tolerances

 

Standard

Special

Comments

Stack-up

Total thickness of the circuit (1,6mm)

±0,16

 

 

Flatness

1,0%

0,8%

Special tolerances to order

Drilling capacities

Drill hole position tolerance

±0,075

±0,05

 

Scoring

Real position

±0,125

±0,1

 

Milling

Milling tolerance

x<25,4mm: ±0,1.
25,4<x<127mm:±0,15.
x>127mm: ±0,20mm

 

Depending on the thickness of the circuit/p>

Internal milling hole tolerances

x<25,4mm: ±0,1.
25,4<x<127mm:±0,15.
x>127mm: ±0,20mm

 

Depending on the size

Internal Layers

Tolerances thickness/space

Initial thickness internal copper 17 µ

±20%

±10%

Special tolerances to order

Initial thickness internal copper 35 µ

±25%

±20%

Special tolerances to order

Initial thickness internal copper 70 µ

±25%

±20%

Special tolerances to order

External layers after metallisation

Tolerances thickness/space

Initial thickness internal copper 17 µ

±20%

±10%

Special tolerances to order

Initial thickness internal copper 35 µ

±25%

±20%

Special tolerances to order

Initial thickness internal copper 70 µ

±25%

±20%

Special tolerances to order

General

Variation register layer to layer

±0,125

 

 

 

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Tecci

Polígono industrial Aranaztegi
Avenida Aranaztegi, 8
20140 Andoain Gipuzkoa (Spain)
Tel.: +34 943 ...  view telephone
Fax: +34 943 ...  view fax
comercial@tecci.com