More than 30 years of experience are our guarantee as manufacturers
of high-quality printed circuit boards for professional electronics.
Effort, professionalism and know-how are the mainstays of the company's workforce.
The continuous improvement in our processes has always been a constant in our organisation.
We work based on the customer's design. Our technical staff collaborates and
advises to guarantee the quality of the product from the very start.
Services
Outsourcing
Due to the market situation and in line with the demands of several of our customers, for years we have been in close collaboration with two printed circuit board manufacturers located in Shenzhen (Chinese) which can manufacture all the printed circuit technologies. 4 years ago we opened our delegation in Shenzhen. We have people from our team controlling the processes and the work in production on a daily basis to assure both the quality and compliance with strict deadlines.
Download technical specifications
Technical Capacities
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Standard |
Special |
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Materials |
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Type |
Iteq: IT-140TC, IT-158TC, IT-180A |
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Other materials to order |
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ShengYi : S1600, S1141, S1155, S1000, S1000-2 |
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Nanya: NPG-TL, NP140-TL |
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Kingboard: KB-6160 |
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Internal Layers |
Min: 0.1mm |
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Other thicknesses to order |
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Max: 2mm |
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Prepregs |
7628(RC48%): 0.211±0.02mm |
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Other thicknesses to order |
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7628(RC45%): 0.205±0.02mm |
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7628(RC43%): 0.182±0.018mm |
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1506(RC48%): 0.167±0.016mm |
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2116(RC56%): 0.132±0.013mm |
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2116(RC51%): 0.116±0.01mm |
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1080(RC63%): 0.076±0.07mm |
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1080(RC68%): 0.087±0.08mm |
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106(RC72%): 0.05±0.005mm |
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106(RC75%): 0.057±0.005mm |
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2113/3313(RC56%):0.103±0.01mm |
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Stack-up |
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Total maximum thickness |
3.8mm |
5mm |
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Initial copper thickness |
18-35-70-105µ |
140-175-210µ |
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Maximum number of layers |
16 |
30 |
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Panelled |
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Maximum size Panel |
622x546mm |
850x622mm |
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Silkscreen Printing Inks |
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Photosensitive Mask |
Green, Black, Blue, Red, Yellow |
White LED |
Other colours to order |
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Silkscreen Components |
White, Black, Yellow |
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Other colours to order |
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Graphite |
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Yes |
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Peelable Ink |
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Yes |
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Surface Finishes |
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HASL Sn/Cu |
Yes |
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HASL Sn/Pb |
Yes |
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Chemical Tin |
Yes |
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OSP |
Yes |
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ENIG |
Yes |
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Hard Gold |
Yes |
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Mix of surface finishes |
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Chemical Silver + Nickel-Gold Connector |
Yes |
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HASL + Nickel-Gold Connector |
Yes |
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ENIG + Nickel-Gold Connector |
Yes |
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Drilling capacities |
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Drilling aspect ratio |
8:1 |
10:1 |
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Minimum diameter of drill hole-track |
0.2mm |
0.1mm |
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Minimum diameter of metallised drill hole |
0.2mm |
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Scoring |
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Angle |
30¼,45¼,60¼ |
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Milling |
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Standard milling cutter diameter |
0,7-2,4mm |
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Capacities internal layers |
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Minimum width of the conductor |
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Base copper 17µm |
0.07mm |
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Base copper 35µm |
0.09mm |
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Base copper 70µm |
0.1mm |
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Minimum conductor space: (Airgap) |
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Base copper 17µm |
0.08mm |
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Base copper 35µm |
0.11mm |
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Base copper 70µm |
0.2mm |
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Minimum insulations |
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Minimum insulation between final drill hole and antipad |
Final diameter of drill hole +0,17mm |
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Minimum crown of metallised drill hole |
0.13mm |
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General |
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Distance between conductor and plate edge |
PTH: 0.15mm/MLB:0.2mm |
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Capacities External Layers |
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Minimum Width of the conductor |
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Base copper external layers 17µm |
150 µm |
127µm |
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Base copper external layers 35µm |
175 µm |
150µm |
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Base copper external layers 70µm |
225 µm |
200µm |
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Minimum space between conductors: (Airgap) |
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Base copper external layers 17µm |
150 µm |
127µm |
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Base copper external layers 35µm |
175 µm |
150µm |
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Base copper external layers 70µm |
225 µm |
200µm |
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Minimum insulations |
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Minimum crown of metallised drill hole |
Drill hole diameter +0.08mm |
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General |
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Distance between conductor and plate edge |
PTH: 0.15mm/MLB:0.2mm |
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Soldermask |
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Minimum width of Mask outline |
Min:0.075mm |
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Crown of Mask |
Min:0.035 |
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Thickness of mask on metal |
³10µm |
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Mask register |
0.035mm |
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Electric test |
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Impedance Control |
±20% |
±10% |
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Minimum Continuity Resistance |
5 ohm |
2ohm |
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Maximum Test Voltage |
300V |
5000V |
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Insulation Resistance |
Max: 100Mohm |
Max: 250Mohm |
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Maximum size Test template |
940x360mm |
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Maximum testable size FlyingProbe |
510x620mm |
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Minimum distance between test points |
0,30mm |
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Minimum distance between test pads |
0,15mm |
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Documentation |
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Documentation files format |
GERBERS, DPF |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Asymmetric file format |
IPC 356 |
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Comparison netlist format |
IPC 356 |
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Tolerances
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Standard |
Special |
Comments |
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Stack-up |
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Total thickness of the circuit (1,6mm) |
±0,10 |
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Flatness |
0.5% |
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1.5% in asymmetric constructions |
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Drilling capacities |
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Drill hole position tolerance |
±0.05mm |
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1st drill hole ±0,05mm/2nd drill hole ±0.075mm |
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Scoring |
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Real position tolerance |
CNC ±0.05mm/Manual ±0.1mm |
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Milling |
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Milling tolerance |
±0.10mm |
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Internal milling hole tolerances |
±0.15mm |
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Internal Layers |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
0.07/0.08mm |
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Initial thickness internal copper 35 µ |
0.09/0.11mm |
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Initial thickness internal copper 70 µ |
0.1/0.2mm |
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External layers after metallisation |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
0.08/0.10mm |
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Initial thickness internal copper 35 µ |
0.10/0.17mm |
0.10/0.12mm |
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Initial thickness internal copper 70 µ |
0.12/0.24mm |
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General |
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Variation register layer to layer |
²0.076mm |
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Polígono industrial Aranaztegi
Avenida Aranaztegi, 8
20140 Andoain Gipuzkoa (Spain)
Tel.:
+34 943 ... view telephone
Fax:
+34 943 ... view fax
comercial@tecci.com
PROYECTO ACTIVE
INVESTIGACIÓN Y DESARROLLO DE NUEVA GENERACIÓN DE PRODUCTOS FUNCIONALES CON CAPACIDAD DE INTERACCIÓN CON EL ENTORNO EN EVOLUCIÓN
El proyecto ACTIVE, titulado “Investigación y desarrollo de nueva generación de productos funcionales con capacidad de interacción con el entorno en evolución”, en el que TECCI CIRCUITOS IMPRESOS S.L. participa junto con Maier, Cikautxo, Grupo Delta Ediciones Digitales, Ampo, Lan Mobel Masermic y Ojmar tiene como objetivo desarrollar una nueva generación de productos funcionales con capacidad de interacción de forma activa con el entorno mediante la investigación industrial de innovadoras tecnologías de tratamiento de superficies versátiles y adaptables a los procesos de producción de las empresas.
Número de expediente HAZITEK ESTRATÉGICO: ZE – 2019 / 00009
Actuación cofinanciada por el Gobierno Vasco y la Unión Europea a través del Fondo Europeo de Desarrollo Regional 2014-2020 (FEDER)
