More than 30 years of experience are our guarantee as manufacturers
of high-quality printed circuit boards for professional electronics.
Effort, professionalism and know-how are the mainstays of the company's workforce.
The continuous improvement in our processes has always been a constant in our organisation.
We work based on the customer's design. Our technical staff collaborates and
advises to guarantee the quality of the product from the very start.
Double-sided Printed Circuit Boards
From the start of our career as printed circuit board manufacturers we have focused on the manufacture of small-medium series of all kinds of metallic double-sided circuit boards, and we have a monthly manufacturing capacity of 5000 m2. Automated lines and machinery with state-of-the-art technology, complemented with auxiliary installations, guarantee a quality product and strict deadlines.
Thanks to the constant updating of our machinery and the latest advances in drilling, direct and electrolytic metallisation using pulse current, image, milling, scoring, electric testing and metallic finishes, we guarantee the efficacy and reliability of our products.
Download technical specifications
Technical Capacities
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Standard |
Special |
Comments |
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Materials |
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Type |
CEM 3 |
FR4 CTI 0 |
Other materials to order |
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FR4 Tg 135ºC |
FR4 Tg 135ºC AntiCAf |
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FR4 Tg 150ºC AntiCAf |
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FR4 Tg 170ºC AntiCAf |
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FR4 Tg 150ºC AntiCAf-Halogen free CTI 2 |
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Material thickness |
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0,8-2,4mm |
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Base Copper |
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17-35-70 µm |
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Other thicknesses to order |
| Silkscreen Printing Inks | |||
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Photosensitive Mask |
Green, Black, Blue, Red |
White LED |
Other colours to order |
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Silkscreen Components |
White, Black, Yellow |
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Other colours to order |
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Graphite |
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Yes |
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Peelable Ink |
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Yes |
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Surface Finishes |
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HASL Sn/Cu |
Yes |
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HASL Sn/Pb |
Yes |
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Chemical Tin |
Yes |
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OSP |
Subcontracted |
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ENIG |
Subcontracted |
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Hard Gold |
Subcontracted |
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Mix of surface finishes |
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Chemical Tin + Nickel-Gold Connector |
No |
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HASL + Nickel-Gold Connector |
Yes |
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ENIG + Nickel-Gold Connector |
Yes |
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DRILLING CAPACITIES |
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Drilling aspect ratio |
6:1 |
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Minimum diameter drill hole |
0,30 mm |
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Minimum diameter metallised drill hole |
0,20 mm |
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SCORING |
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Angle |
30º |
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Milling |
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Standard milling cutter diameter |
2 mm |
1-1,6-3,2 |
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Conductor insulation width |
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Base Copper 17 µm |
150 µm |
127 µm |
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Base Copper 35 µm |
175 µm |
150 µm |
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Base Copper 70µm |
225 µm |
200 µm |
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Minimum conductor space: (Airgap) |
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Base Copper 17 µm |
150 µm |
127 µm |
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Base Copper 35 µm |
175 µm |
150 µm |
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Base Copper 70µm |
225 µm |
200 µm |
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Distances Pad-Metallised drilling |
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Minimum pad for metallised drill hole |
Final drill hole + 0,35 |
Final drill hole + 0,25 |
With Teardrops |
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General |
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Distance between conductor and plate edge |
0,5 mm |
With milling cutter 0,2mm |
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Soldermask |
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Minimum width of Mask outline |
100 µm |
80 µm |
For green mask |
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Crown of Mask |
100 µm |
75 µm |
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Thickness of mask on metal |
5/30 µm |
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Register of mask |
125 µm |
75 µm |
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Electric test |
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Continuity Resistance |
30 ohm |
10 ohm |
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Voltage of the Test |
150-200 V |
250 V |
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Insulation Resistance |
25 Mohm |
100 Mohm |
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Maximum size Test template |
230x300 |
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Maximum testable size FlyingProbe |
457x610 |
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Minimum distance between test points |
0,18 mm |
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Minimum distance between test pads |
0,08 mm |
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Documentation |
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Documentation files format |
GERBERS, DPF |
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Drilling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Milling file format |
GERBERS, DPF,EXCELLON, SIEB MEYER |
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Electrical files format |
IPC 356 |
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Comparison netlist format |
IPC 356 |
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Tolerances
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Standard |
Special |
Comments |
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Stack-up |
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Total thickness of the circuit (1,6mm) |
±0,16 |
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Flatness |
1,0% |
0,8% |
Special tolerances to order |
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Drilling capacities |
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Drill hole position tolerance |
±0,075 |
±0,05 |
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Scoring |
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Real position |
±0,125 |
±0,1 |
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Milling |
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Milling tolerance |
x<25,4mm: ±0,1. |
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Depending on the thickness of the circuit/p> |
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Internal milling hole tolerances |
x<25,4mm: ±0,1. |
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Depending on the size |
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Internal Layers |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
±20% |
±10% |
Special tolerances to order |
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Initial thickness internal copper 35 µ |
±25% |
±20% |
Special tolerances to order |
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Initial thickness internal copper 70 µ |
±25% |
±20% |
Special tolerances to order |
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External layers after metallisation |
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Tolerances thickness/space |
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Initial thickness internal copper 17 µ |
±20% |
±10% |
Special tolerances to order |
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Initial thickness internal copper 35 µ |
±25% |
±20% |
Special tolerances to order |
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Initial thickness internal copper 70 µ |
±25% |
±20% |
Special tolerances to order |
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General |
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Variation register layer to layer |
±0,125 |
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Polígono industrial Aranaztegi
Avenida Aranaztegi, 8
20140 Andoain Gipuzkoa (Spain)
Tel.:
+34 943 ... view telephone
Fax:
+34 943 ... view fax
comercial@tecci.com
PROYECTO ACTIVE
INVESTIGACIÓN Y DESARROLLO DE NUEVA GENERACIÓN DE PRODUCTOS FUNCIONALES CON CAPACIDAD DE INTERACCIÓN CON EL ENTORNO EN EVOLUCIÓN
El proyecto ACTIVE, titulado “Investigación y desarrollo de nueva generación de productos funcionales con capacidad de interacción con el entorno en evolución”, en el que TECCI CIRCUITOS IMPRESOS S.L. participa junto con Maier, Cikautxo, Grupo Delta Ediciones Digitales, Ampo, Lan Mobel Masermic y Ojmar tiene como objetivo desarrollar una nueva generación de productos funcionales con capacidad de interacción de forma activa con el entorno mediante la investigación industrial de innovadoras tecnologías de tratamiento de superficies versátiles y adaptables a los procesos de producción de las empresas.
Número de expediente HAZITEK ESTRATÉGICO: ZE – 2019 / 00009
Actuación cofinanciada por el Gobierno Vasco y la Unión Europea a través del Fondo Europeo de Desarrollo Regional 2014-2020 (FEDER)
